On July 19, 2024, Xiaomi released its first small foldable phone, the Xiaomi MIX Flip. Despite its compact size, it boasts full flagship performance and is equipped with an advanced cooling system to ensure peak performance. Morion Nanotech once again supported Xiaomi's thermal management solution, with the graphene material being a custom product for Xiaomi by Morion Nanotech—ultra-flexible graphene heat dissipation film. This film enables large-scale heat transfer across the screen, allowing the processor's powerful performance to be 'coolly' unleashed.

Xiaomi MIX Flip cooling system diagram © Xiaomi

      Ultra-flexible graphene thermal film is a product with excellent performance, featuring high thermal conductivity, high flexibility, lightweight, and strong thermal stability. Morion Nanotech enhances the product's flexibility by adjusting its micro self-assembled morphology. To meet user-specific application scenarios, Morion Nanotech has independently developed a bending test device, simulating the 180-degree opening and closing of a smartphone to verify the product's bending endurance. Experimental data shows that after over 500,000 cycles of 180-degree opening and closing bends, the thermal conductivity loss of the ultra-flexible graphene thermal film is less than 1%, showing almost no decline. This is another innovative product from Morion Nanotech following their series of thermal management products such as thermal films, vapor chambers, microcavity heat dissipation films, and microcavity phase change vapor chambers, and can be widely applied in foldable screen phones, VR/AR glasses, tablet computers, and other fields.

Ultra-flexible graphene thermal film © Morion Nanotech

       With the rapid development of the 5G era, electronic components are trending towards higher integration and lighter weight. This also imposes higher demands on heat dissipation materials for their thermal conductivity, lightweight nature, and stability. Graphene materials, which offer high thermal conductivity and can be molded into one piece with controllable thickness, will provide customers with more comprehensive thermal management solutions.

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