1. Excellent thermal conductivity and temperature uniformity performance, with a thermal conductivity coefficient of greater than 1650 W/m·K;
2. The graphene thermal conductive film has good flexibility, can withstand a continuous bending durability of over 200,000 times, with almost no decline in performance;
3. Thickness can be customized according to requirements, effectively improving the material's thermal flux.
Graphene thermal conductive film/plate are thermal conductive materials produced by multi-processes technology using graphene oxide as raw material, with excellent temperature resistance and thermal conductivity. The thermal conductivity of graphene thermal conductive film is more than 4 times that of pure copper, and it has good flexibility, making it an excellent choice for thermal management applications such as heat conduction and dissipation.
Graphene thermal conductive plate inherits the characteristics of graphene thermal conductive film and has a thickness greater than 200 μm. It not only has good thermal conductivity but also can increase the heat flux within the same area, making it very suitable for various high-power and high-heat-flux applications.
Model |
GOF-B Series |
OF-C系G列 |
Test Standard |
|||||||||
Item |
Unit |
Value |
||||||||||
Appearance |
/ |
Flake |
Visual |
|||||||||
Thickness |
μm |
40 ± 4 |
80 ± 8 |
100 ± 10 |
200 ± 20 |
300 ± 30 | 400 ± 40 |
80 ± 8 |
100 ± 10 |
ASTMD374 |
||
Density |
g/cm³ |
≈2.0 |
≈2.0 |
≈2.0 |
≈2.0 |
>1.9 | >1.9 |
≈2.0 |
≈2.0 |
GB/T 13542.2-2009 |
||
Tensile strength |
Mpa |
≈20 |
≈20 |
≈20 |
≈20 |
≈20 | ≈20 |
≈20 |
≈20 |
ASTM F152-95(2009) |
||
Using temperature |
℃ |
-50~130 |
-50~130 |
-50~130 |
-50~130 |
-50~130 | -50~130 |
-50~130 |
-50~130 |
IEC 60068-2-14 |
||
Thermal conductivity (in plane)
|
W/m·k |
≈1300 |
≈1300 |
≈1300 |
≈1300 |
≈1300 | ≈1300 |
≈1500 |
≈1500 |
ASTM E1461-2014 |
||
Thermal diffusion coefficient |
mm2/s |
≈760 |
≈760 |
≈760 |
≈760 |
≈760 | ≈760 |
≈840 |
≈840 |
ASTM E1461-2013 |
||
Specific heat |
J/g·k |
0.85 |
0.85 |
0.85 |
0.85 |
0.85 | 0.85 |
0.85 |
0.85 |
ASTM E1269-2011 |
||
Folding test |
次 |
>100000 |
>100000 |
>100000 |
/ |
/ | / |
>100000 |
>100000 |
MIT |
||
Heat-resistance temperature (atmospheric pressure) |
℃ |
≤500 |
≤500 |
≤500 |
≤500 |
≤500 | ≤500 |
≤500 |
≤500 |
TG-DSC |