At the "Xiaomi Human-Vehicle-Home Full Ecosystem Launch Event" held on June 26, 2025, Xiaomi officially launched its new generation of clamshell flagship phone – Xiaomi MIX Flip2. As the "full-score clamshell" in Xiaomi's foldable screen product line, the phone has achieved significant improvements in terms of design, hardware configuration and user experience. Among them, the "high-performance ultra-flexible graphene thermal conductive Film " provided by Morion Nanotech has helped the further upgrade of the heat dissipation system of Xiaomi MIX Flip2.

Image of Xiaomi MIX Flip2 Phone © Xiaomi

Compared with the similar materials used in Xiaomi's first clamshell foldable phone, MIX Flip (the first generation), this high-performance ultra-flexible graphene thermal conductive film has achieved key technological iterations and upgrades. Test verification shows that its thermal conductivity has significantly increased by 20% compared with the previous generation product. With its excellent thermal conductivity and ultra-flexibility, the graphene thermal conductive film has significantly optimized the overall heat dissipation efficiency of Xiaomi MIX Flip2, effectively ensuring the performance stability of the device under high-load operation, and ultimately bringing users a more excellent and long-lasting experience.

Introduction to Morion Nanotech® High-performance Ultra-flexible Graphene Thermal Conductive Film Product © Morion Nanotech

Morion Nanotech® High-performance Ultra-flexible Graphene Thermal Conductive Film is composed of multiple graphene layers stacked in a highly oriented arrangement, featuring ultra-high thermal conductivity, revolutionary flexible durability, and excellent adaptability to curved precision structures.① Ultra-high thermal conductivity: Using highly oriented self-assembled graphene substrates, the in-plane thermal conductivity reaches 1500W/m·K (≈4 times the thermal conductivity of pure copper), significantly improving the heat flux conduction efficiency and meeting the high-power heat dissipation requirements of foldable screen devices.② Revolutionary flexible durability: Through microstructural optimization, it achieves a combination of ultra-thinness (custom thickness range 40-100μm) and ultra-flexibility; after more than 600,000 times of 180° opening and closing bending tests, the thermal conductivity shows almost no attenuation, perfectly adapting to the repeated bending scenarios of the mobile phone hinge area.③ Excellent adaptability to curved precision structures: The ultra-thin, lightweight and bendable design can closely fit the complex curved structures inside devices such as Xiaomi MIX Flip2, achieving efficient cross-screen heat conduction. Compared with traditional materials, the heat dissipation efficiency is improved by more than 30%.

As a flagship iterative product in Morion Nanotech's thermal management product matrix, this high-performance ultra-flexible Graphene Thermal Conductive Film can be widely applied in fields such as foldable screen phones, VR/AR glasses, and tablet computers. It effectively solves the ternary contradiction of "heat dissipation - lightweight - bending" in highly integrated devices, further promoting the development of heat dissipation technologies for foldable screen phones and curved screen devices.

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